The naming of the integrated circuit
The naming of integrated circuit is mainly composed of a main model (" general series to the device code "+" device serial number "). They are widely used because of the integrated circuit, to put forward a variety of different requirements for integrated circuits, even the same integrated circuit function, on the use of different occasions, the selected models are also different. A kind of integrated circuit is often in the main performance or function under the premise of the same, because the product level (commercial grade, industrial grade, military-grade), packaging materials (plastic, ceramic, metal, etc.), packaging format (dual in, take lead chip carrier, grille type, flat pack, small packaging, etc.), circuit manufacturing process (TTL and CMOS, BICMOS, etc.), how many pins, screening (aging, not aging), circuit operation speed, input/output characteristics, power consumption, such as manufacturers, derive a lot of new varieties. Obviously, a master model can not only fully expresses the derived products feature difference, the question of must be in the main types of regularly add prefixes and suffixes, before and after the particular significance of letters or Numbers as a prefix, suffix, to show the differences between integrated circuit derived products.
* note: the above said "specific meaning" is relative to the manufacturers and the letter (or number) in the type of position. The same letters or Numbers in different manufacturer's product model according to the different meanings and even the same manufacturer's products, the letters or Numbers in the model before and after the location is different, also expressed the different meanings. At present, there is no unified standard in the world, as well as each manufacturer has its own set of naming method, the same vendor for different series of products have different naming method.
Integrated circuit model named method abroad examples
ANALOG DEVICES in the United States company ANALOG DEVICES (AD), for example
Example 1
AD SP 1410 - J D
1, 2, 3, 4, 5
1: the device type prefix, the AD is the abbreviation of simulator parts company
2: device series code
Among them: the ADC - AM - AD converter
DAC, digital to analog converter
G - analog switch, analog multiplexer
LH, OP - operational amplifier
N, P, UHF (ultra high frequency), microwave detector
REF - voltage reference source
SP - multiplexer, the arithmetic logic unit, peripheral controller, support chip microprocessor
V - d/a, frequency divider
VF - phase lock loop, voltage controlled oscillator
3: the device serial number
4: temperature range
I, J, K, L, M = 0 ℃ ~ + 70 ℃
A, B, C = 25 ℃ ~ + 85 ℃
S, T, U = - 55 ℃ ~ + 125 ℃
Note: with the temperature of code in the future, its performance improvements, such as "M" device is obvious than "K"
A good performance
5: packaging format code
Among them: D - ceramic or metal seal dual-in-line
E - leadless chip carrier
F - ceramic flat
H - sealed metal casing
M - computer experiments with a metal shell (DIP sealed metal shell)
Dual in N - plastic
P - plastic leadless
Q -- -- ceramic dual in
R - small outline
One - single chip
Example 2
AD 664 S H / 883 b
1 2 3 4 5 6
1: the device type prefix, the AD is the abbreviation of simulator parts company
2: the device serial number, with 3, and 4 digits
3: mixed information, in 1 to 2 letters
Among them: A, modified products
D - the dielectric insulation
Z - + 12 v power supply work
4: temperature range
5: packaging format code
Among them: 0 - ceramic dual in
Same as other cases
6: screening classification code
Among them: 883 b, in accordance with the MIL - STD 883 b specification;
883 - in accordance with the MIL - STD 883 specification
The current naming method of national standard
Does the device type
T: TTL circuit
H: HTL circuit
E: ECL circuit
C: CMOS circuit
M: memory
U: single-chip circuit
F: linear amplifier
W: voltage stabilizer
D: acoustics, TV circuit
J: interface circuit
AD: A/D converter
DA: D/A converter
SC: special communication circuit
Does the work temperature range
C: 0-70 ℃
G: - 25-70 ℃
L: - 25-85 ℃
E: - 40-85 ℃
R: - 55-85 ℃
M: - 55-125 ℃
Does encapsulation
F: multilayer ceramic flat
B: plastic flat
H: black porcelain flat (CFP)
D: dual in multilayer ceramics
J: black porcelain dual in
P: dual in plastic
S: plastic single upright
T: round metal shell
C: ceramic chip carrier
E: plastic chip carrier
G: grid pin grid array
SOIC: a small lead encapsulation
The PCC: plastic chip carrier
LCC: ceramic chip carrier